• Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
  • Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
  • Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
  • Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
  • Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
  • Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel

Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel

Refractoriness (℃): 1770< Refractoriness< 2000
Feature: Long Time Materials, Instant Materials
Type: Kiln Furniture
Shape: Batts, Plate, Support ,Post
Material: Oxide Bonded Silicon Carbide
Max Temperature: 1620
Samples:
US$ 0/Piece 1 Piece(Min.Order)
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Diamond Member Since 2018

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Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
YUFENGREC-OSIC1550
Bulk Density
2700 - 2750 Kg/M3
Compressive Strength
130 MPa
Modulus of Rupture
50 MPa
Transport Package
Plywood Box
Specification
500 x 400 x 8 mm
Trademark
YUFENGREC
Origin
China
HS Code
69091200
Production Capacity
1000 Mt/ Year

Product Description

Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel

YUFENGREC®Oxide Bonded Silicon Carbide Plate /Setters mainly composed of silicon carbide, silicon micropowder, etc., and is formed and fired under high temperature  in a shuttle kiln. 

 

The product has excellent oxidation resistance, thermal shock stability, compact structure, high temperature volume stability, high temperature bending strength and other advantages.Meanwhile ,It can maximize the utilization rate of the kiln and the energy saving rate. In addition, it has good compactness, high temperature load, not easy to deform, not easy to slag, firm seam, and the alumina coating is not easy to fall off. Long life and reduced customer defect rate

 
Key Feature  of Oxide Bonded Silicon Carbide Plate

 

*    High Temperature Strength .

*    Outstanding Thermal Shock Resistance.

*    Excellent Thermal Conductivity.

*    Heavy loading weight under high temperature applications.

*    Increasing the efficiency of kiln loading, save energy
*    Good Anti-oxidant  performance

Application of Oxide Bonded Silicon Carbide Plate 

*   Electronic Industry

*   Sanitary Ware Industry

*   Ceramic Industry
*   Grinding wheel
*   Magnetic Material   
*   Making different  shape of kiln furniture


 

Technical Data   of Nitride Bonded Silicon Carbide Kiln Furniture 
 

Item  Unit  Typical Index 
Physical Properties 
Max. Application Temperature  ºC 1550
Refractoriness  SK 39
Refractoriness Under Load 0.2 MPa ºC 1750
Bulk Density g/cm3 2.70-2.75 
Apparent Porosity % 7-8
Compression Strength  MPa 130
Modulus of Rupture    MPa 50 (Room Temp.)
MPa 50  (1400 ºC)
Thermal Conductivity at 1000 ºC Kcal/m.hr.ºC 13.5-14.5 
Thermal Expansion at 1000 ºC 0.42-0.48
Thermal Shock Resistance 
 
Excellent 
Chemical Composition 
SiC % 90
The data are average results of tests under standard procedures and are subject to variation. Results should not be used for specification purposes or creating any contractual obligation. For more information on the safety applications or materials ,please refer to the work practices and material safety data sheet 

QC INSPECTION TO ASSURE OF  EACH PRODUCTS  ACCUTE SIZE 
Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel


APPLICATIONS REFERERNCE - Grinding Wheel in Arasive industry 
Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel

Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel

Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel
Oxide Bonded Silicon Carbide Plate Tiles / Pillar for Grinding Wheel


 

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Diamond Member Since 2018

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company
Registered Capital
1000000 RMB
Plant Area
1001~2000 square meters